The first chemical mechanical polishing equipment in China that has independent intellectual property rights and is suitable for the 0.25μm/6~8-inch wafer flattening process has been successfully developed in the 48th of China Electronics Technology Group Corporation.
The successful development of this equipment has filled the blank of 0.25μm/6~8-inch wafer flattening equipment in China's IC equipment manufacturing industry, which is of great practical significance for improving the overall R&D level and industrial core competitiveness of China's integrated circuits.
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